Electronic Components and Technology Conference
水仙直播 is an exhibitor and a sponsor at the 75th Electronic Components and Technology Conference (ECTC). We look forward to seeing you at our booth #314.
水仙直播’s Chet Lenox will be part of a panel at the Special Session 2, “Hybrid Bonding (HB): to B, or not to B? Needs and challenges for the next decade”, Tuesday, May 27, 8:30 am to 10:00 am, Texas 1- 3 rooms.
is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology, and education in an environment of cooperation and technical exchange.
| Event Date: | Wednesday, May 28 - Thursday, May 29, 2025 |
| Location: | |
| Booth: | #314 |
